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Improve oven process efficiency
Semiconductor chip packaging test
Current bottleneck
The fixture in the factory is easy to be damaged and deformed, and it is too heavy to use, which is easy to cause personnel burden. The number of fixtures in the old design is too large in volume/weight, and the number of oven devices is limited according to the specification, which affects the product operation. After the old fixture is discharged from the oven, the cooling stop time is too long, and the cycle time of the finished product in PMC process is too long. The ability to improve the Warpage of the product is poor.
Design goal
Design the special oven fixture according to the characteristics (considering the product operation volume/weight/volume/operation convenience, etc.). The improvement of operation volume and cooling efficiency will increase the production capacity of PMC process by UPH. The cycle time is effectively reduced and the utilization turnover rate of fixture is improved. The durability is higher than that of the old fixture. It can effectively improve the Warpage problem of the product.
Application benefit
Only 81% of the weight of the traditional fixture can significantly increase the baking volume and reduce the cooling time and overall cycle time. Oven loading increased by 25% UPH. The oven process can improve 39% UPH efficiency. This data is the measured data of the packaging factory
Appearance description
Appearance description
Oven clamp pressure fixture
Oven baking fixture
Holding and baking combination
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